A rapid-cure, Ag-coated Nickel-filled silicone elastomer Form-in-Place gasket material.

Laird Technologies introduces its newest line of FIP products—EMI Sentry. These Form-In-Place pastes are extremely fast curing with reliable shielding effectiveness and strength

Laird Technologies’ Form-In-Place is an automated system for dispensing conductive elastomer EMI shielding and grounding gaskets onto metal or plastic substrates. This product is particularly ideal for basestations, PDAs, PC cards, radios, mobile phones, as well as many other cast enclosures and packaged electronic assemblies.

(a) Compression-deflection bead size 0.60 mm (H) x 0.70 mm (W)

(b) Time to effectively cure a bead will necessarily depend on individual conditions, including bead size, shield size and weight, oven capacity, and oven ramp-rates.