PRODUCTS

Seantec provides a wide variety of high-performance thermal and EMI materials,to meet the divers needs and innovation requirements of customer in various industries.

Thermal pads
Tflex™ 300 Series Thermal Gap Filler
Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times.
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PRODUCT DESCRIPTION
TYPICAL PROPERTY DATA

UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE


Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times.


Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.

Tflex™ 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.Tflex™ 300-TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a guaranteed dielectric barrier, and easier part handling for mass production.


FEATURES AND BENEFITS


• Extreme compliancy allows material to “totally blanket” component(s)

• Thermal conductivity of 1.2 W/mK

• Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm)

• Low compression set enables the pad to be reused many times


APPLICATIONS


  • Notebook and desktop computers

  • Telecommunication hardware

  • Flat panel displays

  • Memory modules

  • Power conversion equipment

  • Set top box

  • Lighting ballast

  • Automotive electronics

  • LED lighting

  • Handheld electronics

  • Optical disk drives

  • Vibration dampening


STANDARD THICKNESSES


0.020 to 0.200-inch (0.5 to 5.0mm)* 

0.020 to 0.200-inch thick material available in 0.010-inch (0.25mm) increments

0.250-inch (6.4 mm) also available with TG liner option only.

*Inquire about availability of material and options above 0.200-inches


OPTIONS


Tgard™ “TG” dielectric barrier available to aid in handling and PET dielectric “H” liner available for applications where easy slide assembly is desirable


MATERIAL NAME AND THICKNESS 


Tflex™ indicates elastomeric gap filler product line

3xxx indicates high recovery ‘3 series’ 1.2 W/mK material

-DC1 designates proprietary tack eliminated coating

-TG indicates Tgard™ liner option

-H indicates hard PET liner option


EXAMPLES


Tflex™ 3120 = standard 0.120-inch thick Tflex™ 300 material

Tflex™ 3120DC1 = 0.120-inch thick material with DC1 coating

Tflex™ 3120TG = 0.120-inch thick material with Tgard™ liner

Tflex™ 3120H = 0.120-inch thick material with hard PET liner


SPECIFICATIONS


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