PRODUCTS
Seantec provides a wide variety of high-performance thermal and EMI materials,to meet the divers needs and innovation requirements of customer in various industries.
PRODUCTS
PRODUCT DESCRIPTION
Tflex™ HD700 Is our latest product in our High Deflection series. Tflex™ HD700 combines 5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.
Tflex™ HD700 is available in thickness from 0.5mm (0.020”) to 5mm (0.200”). Laird can provide material to meet your production needs in any region through our local production facilities. Please contact your local Laird sales or field engineering contact for samples or questions.
FEATURES AND BENEFITS
5.0 W/mK thermal conductivity
Low pressure versus deflection
Excellent surface wetting for low contact resistance
Minimizes board and component stress
Large tolerance applications
Environmentally friendly solution that meets regulatory requirements including RoHS and REACH


AVAILABILITY
STANDARD THICKNESSES
0.5mm (0.020”) to 5.0mm (0.200”) thick material available in 0.25mm (0.010”) increments
Available in standard sheet sizes of 18” x 18” and 9” x 9” or custom die cut parts OPTIONS
DC1 – eliminate tack from one side PART NUMBER SYSTEM Tflex™ indicates Laird elastomeric thermal gap filler product line. HD7xxx indicates Tflex HD700 product line with thickness in mils (0.001”)
EXAMPLES:
Tflex™ HD740 = 0.040” thick Tflex™ HD700 material
Tflex™ HD7100,DC1 = 0.10” thick Tflex™ HD700 material with DC1 option

MESSAGE
Please leave your message to get the Datasheet,For more information we will contact you by email.Thanks!
MESSAGE
Please leave your message to get the Datasheet,For more information we will contact you by email.Thanks!