FOR HIGH PERFORMANCE TIM APPLICATIONS

IceKap™ P30000 is a silicone-free, high-performance thermal interface material designed for use in TIM 1.5 and TIM 2 applications. In certain instances, IceKap ™ P30000 can be used in TIM 1 applications IceKap™ P30000 utilizes a unique polymer chosen to maximize system performance. The specially designed polymer package:

• Minimizes contact thermal resistance at the interface while offering high thermal conductivity

• Minimizes migration (pump out) at CPU operating temperatures

• Provides “joint healing” capabilities (improved device reliability)

• Contains no silicone

• Allows easy rework, requiring minimal force to separate components

• Survives multiple solder reflow operations

IceKap™ P30000 can be pre-applied to components and stored for future shipment to device

assmeblers.

FEATURES AND BENEFITS 

• Very high thermal performance

• Minimal pump out

• High reliability

• Silicone-free

• Joint healing

• Easy rework

• Solder re-flow compatible

MARKETS / APPLICATIONS

• Semiconductor Packaging

• Graphics Card

• Notebooks

• Desktops

• Servers

• IGBTs

• Automotive

• Memory Modules

• Game Consoles

• Set Top Boxes