PRODUCT DESCRIPTION

Tflex™ SF600 is a high performance, silicone-free thermal gap filler with a conductivity of 3 W/mK. Tflex SF600 is designed for applications which are silicone sensitive.

Tflex SF600 is naturally tacky on both sides, requiring no adhesive coating and allowing for the pad to be held in place during assembly. For applications that may require rework, a differential tack option is available to remove the natural tack from one side of the material.

FEATURES AND BENEFITS 

• Silicone free

• Differential tack option available for easy assembly and rework

• Minimal compression set

• Environmentally friendly solution that meets regulatory requirements including RoHS and REACH

MARKETS / APPLICATIONS

• Semiconductor Packaging

• Graphics Card

• Notebooks

• Desktops

• Servers

• IGBTs

• Automotive

• Memory Modules

• Game Consoles

• Set Top Boxes

AVAILABILITY

STANDARD THICKNESSES

• 0.25mm (0.010”) to 3.56mm (0.140”) thick material available in 0.25mm (0.010”) increments

• Available in standard sheet sizes of 18” x 18” and 9” x 9” or custom die cut partsOPTIONS

• DF – differential tack option available in thicknesses of 0.25 mm(0.010”) to 1.50mm(0.060”)

PART NUMBER SYSTEM

Tflex indicates Laird elastomeric thermal gap filler product line. SF6xx indicates Tflex SF600 product line with thickness in mils (0.001”)

EXAMPLES:

• Tflex SF640 = 0.040 inch thick Tflex SF600 material

• Tflex SF660DF = 0.060 inch thick Tflex SF600 material with DF option