HIGHEST THERMAL CONDUCTIVITY SILICONE-FREE GAP FILLER AVAILABLE

Tflex™ SF800 is a high-performance, compliant, silicone free thermal interface material. By coupling extremely high thermal conductivity with exceptional wetting characteristics, Tflex™ SF800 provides some of the lowest thermal resistance values in the industry. This makes it well-suited for applications where silicone based pads are traditionally used as well as those applications which are silicone sensitive.

Tflex™ SF800 is naturally tacky on both sides requiring no additional adhesive coating, which would inhibit thermal performance. The natural tack allows for the pad to be held in place during assembly.

FEATURES AND BENEFITS 

Silicone-free gap filler

• Thermal Conductivity of 7.8 W/mK

• Exceptionally low thermal resistance

• Available in thicknesses from 0.020-inch (0.50mm) through 0.040-inch (1.00mm) in 0.010-inch increments

• RoHS Compliant

APPLICATION

• Silicone-sensitive applications

• Automotive applications

• Optical components

• Flat panel displays

• Hard disk drives

• Medical devices

• Laser equipment

• Aerospace electronics

• Solar energy

STANDARD THICKNESSES

Standard thickness is 0.020-inch (0.50 mm) through 0.16-inch (4.064mm) in 0.010-inch increments

MATERIAL NAME AND THICKNESS

Tflex ™ indicates Laird Technologies’ gap filler product line. SF8XXX indicates Tflex ™ SF800 product line with thickness in mils (0.001-inches).

EXAMPLES:

Tflex™ SF840 = standard 0.040-inch thick Tflex™ SF800 material.

Data for design engineer guidance only. Observed performance varies in application.

Engineers are reminded to test the material in application.