PRODUCT DESCRIPTION

Tpcm™ 5000 is a new high-performance TIM in the Laird product offering. Tpcm™ 5000 is designed to provide the best performance to price available. Tpcm™ 5000 provides very low thermal resistance by coupling high thermal conductivity of 5.3 W/mK, minimal bondline thickness, and with superior wetting of the mating surfaces. Softening between 50°C – 70°C, the initial pad thickness can decrease to a bondline as thin as 25µm. 

Tpcm™ 5000 reliability has been demonstrated though exposure to 1000 hours of various aging tests resulting in proven dependability at an operating temperature of 125°C. 

The specialty polymeric matrix offers superior pump out resistance when compared to thermally conductive greases and other phase change materials. Tpcm™ 5000 has been formulated to provide just the right tack, remaining on liners yet easily removeable for application.

FEATURES AND BENEFITS 

• 5.3 W/mK bulk thermal conductivity

• Cost effective

• Non silicone formulation that provides naturallytacky surface

• Fully characterized long term reliability

• No pump out

• Easy rework

MARKETS

• Semiconductor Packaging

• Graphics Card

• Notebooks

• Servers

• IGBTs

• Automotive

• Memory Modules

• Game Consoles

AVAILABILITY

• Sheets and Die Cuts

• Die cut on strips w/tabs
  

• Die cut on rolls w/tabs

• Production Volume Manufacturing:

• Designed for use with the TIM Print

• Refer to “TIM Print Application Guide”

STORAGE CONDITIONS

• Store in original packaging or a light-proof package

• Store at 0-30⁰C & maximum 50% RH

• Shelf Life: 1 year from date of shipment when stored at above conditions