PRODUCT DESCRIPTION

At 6.4 W/m-K thermal conductivity,  Tflex™  CR607 is at the forefront of thermal performance for a two-part, cure in place dispensable gap filler. This dispensable gap filler minimizes stress on components during assembly while providing the reliability of a traditional thermal pad. Tflex™  CR607 has been designed for reliability, intended to pass stringent vertical shock and vibe requirements of the automotive industry.

The 1:1 mix is dispensable through a wide variety of dispensing equipment.  It is an A+B putty material that cures in place after dispensing and mixing to perfectly fill the gap. The experts at Laird can help design the system that is right for you. 

Tflex™  CR607 is a soft, compliant, high thermal conductivity dispensable gap filler providing the lowest thermal resistance and highest reliability available.

FEATURES AND BENEFITS

    •  Thermal Conductivity 6.4W/mK

•  Dispensable and Compliant

•  Easily reworkable

•  Ideal for large gaps

•  Meets ROHS and REACH requirements

APPLICATIONS

•  Telecom base stations

•  Graphic chips

•  Microprocessors

•  High-power automotive electronic controls