Product Description

Tflex™ UT20000 is a specially formulated ultra-thin gap filler thermal interface material designed for thin interfaces that offers excellent thermal performance and high compliancy. It is designed without embedded reinforcing fiberglass to minimize contact resistance, yet still allows easy material handling and durability during assembly. 

Tflex™ UT20000 provides excellent interfacing and its ability to wet out mating surfaces allows for efficient transfer of heat away from components. It is an ideal choice for low-pressure applications and optimum solution in handheld devices with thin interface gap and limited space requirements.

Tflex™ UT20000 is electrically non-conductive, stable from -50°C thru 200°C and offered in

thicknesses that range from 0.008” (200 µm) up to 0.040” (1000 µm).

FEATURES AND BENEFITS

• Thermal Conductivity of 3.0 W/mK

• No fiberglass carrier to minimize thermal resistance, yet still easy to handle

• Excellent surface wetting for low contact resistance

• Unique formulation minimizes thermal resistance at low mounting forces

• Environmentally friendly solution that meets regulatory requirements including RoHS and REACH

AVAILABILITY

STANDARD THICKNESSES

• 0.008” (200 µm) up to 0.020” (500 µm) thick material available in 25 µm increments

• Also available in 0.025” ( 625um), 0.030” (750 um), 0.035” (875um) , 0.040” (1000 um)

• Available in standard sheet sizes of 18” x 18” and 9” x 9” or custom die cut parts. Custom die cut parts on a roll available for 200 µm(0.008”) thru 375 µm (0.015”)

PART NUMBER SYSTEM

Tflex™ indicates Laird elastomeric thermal gap filler product line. UT20000 indicates Tflex UT20000 product line with thickness in microns

EXAMPLES :

• Tflex™ UT20200= 200 µm (0.008”) thick Tflex™ UT20000 material

• Tflex™ UT20500= 500 µm (0.020”) thick Tflex™ UT20000 material